Patent Assignment
Reel/Frame 047534/0571
Assignment of Assignor's Interest
Recorded: 2018-11-17
Pages: 5
Assignors
LIU, SHASHA
Executed: 2018-10-16
XIAO, LI HONG
Executed: 2018-10-16
WANG, ENBO
Executed: 2018-10-16
LU, FENG
Executed: 2018-10-16
XU, QIANBIN
Executed: 2018-10-16
Assignee
YANGTZE MEMORY TECHNOLOGIES CO., LTD.
18 GAOXIN 4TH ROAD, EAST LAKE HIGH-TECH DEVELOPMENT ZONE, WUHAN, CHINA
Covered Property
(1)
Three-Dimensional Memory Device Having Semiconductor Plug Formed Using Backside Substrate Thinning