IP Library › Assignment 047553/0311
Patent Assignment
Reel/Frame 047553/0311

Assignment of Assignor's Interest

Recorded: 2018-11-20 Pages: 8
Assignors
YOO, CHAN
Executed: 2017-05-25
SINGH, AKSHAY
Executed: 2017-06-12
XU, YI
Executed: 2017-06-04
FOSTER, LIANA
Executed: 2017-05-24
ESKILDSEN, STEVEN
Executed: 2017-05-30
Assignee
MICRON TECHNOLOGY, INC.
8000 S. FEDERAL WAY, BOISE, IDAHO, 83716
Covered Property (1)
Face Down Dual Sided Chip Scale Memory Package
Application: 16/196,262 →
Publication: US 2019/0088565
Related Assignments (4)
Other recorded transfers of the patent in this record — the chain of ownership.
Supplement No. 11 to Patent Security Agreement Jan 16, 2019
From: MICRON TECHNOLOGY, INC.
To: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
Reel/Frame 048082/0860 →
Supplement No. 2 to Patent Security Agreement Jan 16, 2019
From: MICRON TECHNOLOGY, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 048082/0889 →
Release of Security Interest Oct 14, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.
Reel/Frame 050718/0764 →
Release of Security Interest Nov 15, 2019
From: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.
Reel/Frame 051026/0568 →