Patent Assignment
Reel/Frame 047565/0035
Assignment of Assignor's Interest
Recorded: 2018-11-21
Pages: 6
Assignors
CHEN, WEI-YU
Executed: 2018-07-06
CHENG, CHIA-SHEN
Executed: 2018-07-06
PEI, HAO-JAN
Executed: 2018-07-06
CHUNG, PHILIP YU-SHUAN
Executed: 2018-07-06
HUANG, KUEI-WEI
Executed: 2018-07-06
LIN, HSIU-JEN
Executed: 2018-07-06
HSIEH, CHING-HUA
Executed: 2018-07-06
YU, CHEN-HUA
Executed: 2018-07-27
LIU, CHUNG-SHI
Executed: 2018-07-27
TSAI, YU-PENG
Executed: 2018-11-08
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Bonding Through Multi-Shot Laser Reflow