Bonding through multi-shot laser reflow

1. A method comprising:

performing a first laser shot on a first portion of a top surface of a first package component, wherein the first package component is over a second package component, and a first solder region between the first package component and the second package component is reflowed by the first laser shot;

after the first laser shot, allowing the first solder region to solidify; and

after the first solder region solidifies, performing a second laser shot on a second portion of the top surface of the first package component, wherein a second solder region between the first package component and the second package component is reflowed by the second laser shot.

2. The method of claim 1 , wherein:

the first portion of the top surface overlaps a first plurality of solder regions, and the first plurality of solder regions are reflowed by the first laser shot; and

the second portion of the top surface overlaps a second plurality of solder regions, and the second plurality of solder regions are reflowed by the second laser shot.

3. The method of claim 2 , wherein the first plurality of solder regions and the second plurality of solder regions comprise common solder regions.

4. The method of claim 2 , wherein the first plurality of solder regions are separate ones from the second plurality of solder regions.

5. The method of claim 1 further comprising:

after the second laser shot, performing a third laser shot on a third portion of the top surface of the first package component, wherein a third solder region between the first package component and the second package component is reflowed by the third laser shot.

6. The method of claim 1 , wherein the first laser shot and the second laser shot in combination cover more than a half of the top surface of the first package component.

7. A method comprising:

performing a first laser shot on a top surface of a first package component, wherein the first package component is over a second package component, and a first solder region between the first package component and the second package component is molten by the first laser shot;

delaying a period of time, wherein the first solder region is solidified during the period of time; and

after the first solder region is solidified, performing a second laser shot on the top surface of the first package component to melt a second solder region between the first package component and the second package component.

8. The method of claim 7 , wherein the first laser shot is performed using a laser beam large enough to cover a first portion of the top surface of the first package component, and a first plurality of solder regions and a second plurality of solder regions are directly under the first portion of the top surface of the first package component.

9. The method of claim 8 , wherein the second laser shot is performed using the laser beam large enough to cover a second portion of the top surface of the first package component, and the second plurality of solder regions and a third plurality of solder regions are directly under the second portion of the top surface of the first package component.

10. The method of claim 7 , wherein the delaying the period of time comprises delaying for 5 seconds to 10 seconds.

11. The method of claim 7 , wherein in the first laser shot, a laser beam is performed on the top surface of the first package component, and heat is transferred through the first package component to the first solder region.

12. The method of claim 7 , wherein the first laser shot and the second laser shot cover a common part of the top surface of the first package component.

13. The method of claim 7 further comprising, after the second solder region solidifies, performing a third laser shot on the top surface of the first package component to melt a third solder region between the first package component and the second package component.

14. The method of claim 7 , wherein the first laser shot covers a portion of the top surface of the first package component, and a power of the first laser shot is distributed substantially uniformly in the portion of the top surface of the first package component.

15. A method comprising:

placing a first package component over a second package component;

performing a first laser shot on the first package component, wherein a first laser beam of the first laser shot covers a first region of the first package component, and a second region of the first package component is out of the first laser beam; and

performing a second laser shot on the first package component, wherein a second laser beam of the second laser shot covers the second region of the first package component, and the first region of the first package component is out of the second laser beam.

16. The method of claim 15 , wherein between the first laser shot and the second laser shot, the first package component stops receiving laser energy.

17. The method of claim 15 , wherein during both of the first laser shot and the second laser shot, a laser-beam generator used for the plurality of laser shots is kept still over the first package component.

18. The method of claim 15 , wherein both of the first laser shot and the second laser shot cover a part of the first package component less than an entire top-view area of the first package component.

19. The method of claim 15 , wherein an interval between the first laser shot and the second laser shot is long enough to allow solder regions molten by the first laser shot to solidify when the second laser shot is performed.

20. The method of claim 1 , wherein the first laser shot and the second laser shot are performed using a laser beam, and the method further comprises turning off the laser beam between the first laser shot and the second laser shot.