IP Library › Assignment 047576/0516
Patent Assignment
Reel/Frame 047576/0516

Assignment of Assignor's Interest

Recorded: 2018-11-26 Pages: 4
Assignors
CH, HSIEN-WEI EN
Executed: 2018-11-14
CHEN, MING-FA
Executed: 2018-11-14
YEH, SUNG-FENG
Executed: 2018-11-13
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK,, HSINCHU, 30078, TAIWAN
Covered Property (1)
Package Structure and Method of Fabricating the Same
Application: 16/199,230 →
Publication: US 2020/0043893
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Corrective Assignment to Correct the the First Assignor's Name Previously Recorded on Reel 047576 Frame 0516. Assignor(S) Hereby Confirms the Assignment of Assignors Interest. Apr 14, 2020
From: CHEN, HSIEN-WEI; CHEN, MING-FA; YEH, SUNG-FENG
To: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
Reel/Frame 052386/0289 →