IP Library › Assignment 052386/0289
Patent Assignment
Reel/Frame 052386/0289

Corrective Assignment to Correct the the First Assignor's Name Previously Recorded on Reel 047576 Frame 0516. Assignor(S) Hereby Confirms the Assignment of Assignors Interest.

Recorded: 2020-04-14 Pages: 7
Assignors
CHEN, HSIEN-WEI
Executed: 2018-11-14
CHEN, MING-FA
Executed: 2018-11-14
YEH, SUNG-FENG
Executed: 2018-11-13
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK,, HSINCHU, 30078, TAIWAN
Covered Property (1)
Package Structure and Method of Fabricating the Same
Application: 16/199,230 →
Publication: US 2020/0043893
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Nov 26, 2018
From: CH, HSIEN-WEI EN; CHEN, MING-FA; YEH, SUNG-FENG
To: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
Reel/Frame 047576/0516 →