Patent Assignment
Reel/Frame 047590/0049
Assignment of Assignor's Interest
Recorded: 2018-11-27
Pages: 3
Assignor
SASAKI, HAJIME
Executed: 2018-11-08
Assignee
MITSUBISHI ELECTRIC CORPORATION
7-3, MARUNOUCHI 2-CHOME, CHIYODA-KU, TOKYO, 100-8310, JAPAN
Covered Property
(1)
Method for Manufacturing Compound Semiconductor Device