Patent Assignment
Reel/Frame 047604/0569
Assignment of Assignor's Interest
Recorded: 2018-11-28
Pages: 6
Assignors
KE, ALLEN
Executed: 2017-11-07
CHIU, YI-WEI
Executed: 2017-11-07
CHANG, HUNG JUI
Executed: 2017-11-07
KUO, YU-WEI
Executed: 2018-01-07
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO. 8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-77, TAIWAN
Covered Property
(1)
Etch Profile Control of Interconnect Structures