Patent Assignment
Reel/Frame 047609/0254
Assignment of Assignor's Interest
Recorded: 2018-11-28
Pages: 5
Assignors
JEE, YOUNG KUN
Executed: 2018-11-21
KIM, IL HWAN
Executed: 2018-11-21
KANG, UN BYOUNG
Executed: 2018-11-21
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Package Having Redistribution Layer