Patent Assignment
Reel/Frame 047632/0564
Assignment of Assignor's Interest
Recorded: 2018-11-30
Pages: 9
Assignors
TONOUCHI, SHUNSUKE
Executed: 2018-11-14
SHIMADA, TOMOKAZU
Executed: 2018-11-14
DANJOUBARA, KAZUTOSHI
Executed: 2018-11-15
FUKUDA, TOMIO
Executed: 2018-11-14
KAKITANI, MINORU
Executed: 2018-11-14
Assignee
HITACHI CHEMICAL COMPANY, LTD.
9-2, MARUNOUCHI 1-CHOME, CHIYODA-KU, TOKYO, 100-6606, JAPAN
Covered Property
(1)
Thermosetting Resin Composition, Prepreg, Laminated Board, Printed Wiring Board, and High-Speed Communication-Compatible Module
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name
Nov 23, 2020
From: HITACHI CHEMICAL COMPANY, LTD.
To: SHOWA DENKO MATERIALS CO., LTD.
Reel/Frame 054497/0838 →
Change of Name
Mar 8, 2023
From: SHOWA DENKO MATERIALS CO., LTD.
To: RESONAC CORPORATION
Reel/Frame 062992/0805 →
Change of Address
Feb 14, 2024
From: RESONAC CORPORATION
To: RESONAC CORPORATION
Reel/Frame 066599/0037 →