Patent Assignment
Reel/Frame 054497/0838
Change of Name
Recorded: 2020-11-23
Pages: 53
Assignor
HITACHI CHEMICAL COMPANY, LTD.
Executed: 2020-10-01
Assignee
SHOWA DENKO MATERIALS CO., LTD.
9-2, MARUNOUCHI 1-CHOME, CHIYODA-KU, TOKYO, 100-6606, JAPAN
Covered Property
(1)
Thermosetting Resin Composition, Prepreg, Laminated Board, Printed Wiring Board, and High-Speed Communication-Compatible Module
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Nov 30, 2018
From: TONOUCHI, SHUNSUKE; SHIMADA, TOMOKAZU; DANJOUBARA, KAZUTOSHI; FUKUDA, TOMIO
To: HITACHI CHEMICAL COMPANY, LTD.
Reel/Frame 047632/0564 →
Change of Name
Mar 8, 2023
From: SHOWA DENKO MATERIALS CO., LTD.
To: RESONAC CORPORATION
Reel/Frame 062992/0805 →
Change of Address
Feb 14, 2024
From: RESONAC CORPORATION
To: RESONAC CORPORATION
Reel/Frame 066599/0037 →