Patent Assignment
Reel/Frame 047638/0012
Assignment of Assignor's Interest
Recorded: 2018-11-30
Pages: 5
Assignors
HSIEH, PO-TSUNG
Executed: 2018-11-22
YANG, CHIA-MING
Executed: 2018-11-22
CHEN, IN-GANN
Executed: 2018-11-22
CHUANG, YA-WEN
Executed: 2018-11-22
TSAI, YA-WEN
Executed: 2018-11-22
TSENG, SHIH-WEN
Executed: 2018-11-22
Assignee
NATIONAL CHENG KUNG UNIVERSITY
NO. 1, UNIVERSITY ROAD,, TAINAN CITY, 701, TAIWAN
Covered Property
(1)
Chip Packaging Device and Alignment Bonding Method Thereof
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.