IP Library › Assignment 054060/0011
Patent Assignment
Reel/Frame 054060/0011

Assignment of Assignor's Interest

Recorded: 2020-10-15 Pages: 2
Assignor
NATIONAL CHENG KUNG UNIVERSITY
Executed: 2020-10-14
Assignee
LIQUIDVIEW TECHNOLOGY CO., LTD.
12F., NO. 65, GONGYUAN S. RD., NORTH DIST., TAINAN CITY, 704, TAIWAN
Covered Properties (2)
Packaging Unit for Liquid Sample Loading Devices Applied in Electron Microscope and Packaging Method
Application: 15/643,493 →
Publication: US 2018/0010988
Chip Packaging Device and Alignment Bonding Method Thereof
Application: 16/199,668 →
Publication: US 2020/0144078
Related Assignments (2)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Jul 11, 2017
From: TSENG, SHIH-WEN
To: NATIONAL CHENG KUNG UNIVERSITY
Reel/Frame 042979/0841 →
Assignment of Assignor's Interest Nov 30, 2018
From: HSIEH, PO-TSUNG; YANG, CHIA-MING; CHEN, IN-GANN; CHUANG, YA-WEN
To: NATIONAL CHENG KUNG UNIVERSITY
Reel/Frame 047638/0012 →