Patent Assignment
Reel/Frame 047640/0941
Assignment of Assignor's Interest
Recorded: 2018-11-30
Pages: 3
Assignee
NINGBO SEMICONDUCTOR INTERNATIONAL CORPORATION
BUILDING 3, BUILDING 4 AND BUILDING 5, 335 ANJU ROAD, XIAOGANG STREET, BEILUN DISTRICT, NINGBO, CHINA
Covered Property
(1)
Packaging Method and Package Structure of Wafer-Level System-In-Package