IP Library Assignment 047646/0505
Patent Assignment
Reel/Frame 047646/0505

Assignment of Assignor's Interest

Recorded: 2018-11-30 Pages: 5
Assignors
LIM, JAE HYUN
Executed: 2018-11-26
KIM, CHUL KYU
Executed: 2018-11-26
JUNG, KYUNG MOON
Executed: 2018-11-26
KIM, HAN
Executed: 2018-11-26
SEO, YOON SEOK
Executed: 2018-11-26
Assignee
SAMSUNG ELECTRO-MECHANICS CO., LTD.
MAEYOUNG-RO 150 (MAETAN-DONG), YOUNGTONG-GU, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property (1)
Semiconductor Package and Board for Mounting the Same
Application: 16/207,053 →
Publication: US 2020/0083176
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Jun 3, 2019
From: SAMSUNG ELECTRO-MECHANICS CO., LTD.
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 049350/0756 →