IP Library › Assignment 047662/0810
Patent Assignment
Reel/Frame 047662/0810

Assignment of Assignor's Interest

Recorded: 2018-12-03 Pages: 3
Assignor
LIU, MENGBIN
Executed: 2018-11-27
Assignee
NINGBO SEMICONDUCTOR INTERNATIONAL CORPORATION
BUILDING 3, BUILDING 4 AND BUILDING 5, 335 ANJU ROAD, XIAOGANG STREET, BEILUN DISTRICT, SHANGHAI, CHINA
Covered Property (1)
Packaging Method and Package Structure of Wafer-Level System-In-Package
Application: 16/208,307 →
Publication: US 2019/0115316
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Corrective Assignment to Correct the Typo on the Receiving Party Address Previously Recorded on Reel 047662 Frame 0810. Assignor(S) Hereby Confirms the Assignment. Apr 19, 2019
From: LIU, MENGBIN
To: NINGBO SEMICONDUCTOR INTERNATIONAL CORPORATION
Reel/Frame 048947/0428 →