Corrective Assignment to Correct the Typo on the Receiving Party Address Previously Recorded on Reel 047662 Frame 0810. Assignor(S) Hereby Confirms the Assignment.

Recorded: 2019-04-19 Pages: 4

Assignor

LIU, MENGBIN

Executed: 2018-11-27

Assignee

BUILDING 3, BUILDING 4 AND BUILDING 5, 335 ANJU ROAD, XIAOGANG STREET, BEILUN DISTRICT, NINGBO, CHINA

Covered Property (1)

Packaging Method and Package Structure of Wafer-Level System-In-Package

Patent: 10,930,617 →

Application: 16/208,307 →

Publication: US 2019/0115316

Related Assignments (1)

Other recorded transfers of the patent in this record — the chain of ownership.