Patent Assignment
Reel/Frame 047667/0646
Assignment of Assignor's Interest
Recorded: 2018-12-04
Pages: 3
Assignors
COLLINS, ANDREW
Executed: 2018-04-17
SHARAN, SUJIT
Executed: 2018-04-24
XIE, JIANYONG
Executed: 2018-04-17
Assignee
INTEL CORPORATION
2200 MISSION COLLEGE BOULEVARD, SANTA CLARA, CALIFORNIA, 95054
Covered Property
(1)
Capacitor Die Embedded in Package Substrate for Providing Capacitance to Surface Mounted Die