Patent Assignment
Reel/Frame 047707/0545
Assignment of Assignor's Interest
Recorded: 2018-12-07
Pages: 3
Assignors
DAI, PIN-REN
Executed: 2018-10-23
TIEN, HSI-WEN
Executed: 2018-10-23
LIAO, WEI-HAO
Executed: 2018-10-24
LU, CHIH WEI
Executed: 2018-10-23
LEE, CHUNG-JU
Executed: 2018-10-23
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, TAIWAN
Covered Property
(1)
Semiconductor Device and Method of Forming the Same