Patent Assignment
Reel/Frame 047715/0726
Assignment of Assignor's Interest
Recorded: 2018-12-09
Pages: 3
Assignors
SEYAMA, KOHEI
Executed: 2018-11-29
EGUCHI, YUJI
Executed: 2018-11-29
WADA, SHOJI
Executed: 2018-11-29
Assignee
SHINKAWA LTD.
51-1 INADAIRA 2-CHOME, MUSASHIMURAYAMA-SHI,, TOKYO, 208-8585, JAPAN
Covered Property
(1)
Bonding apparatus including a heater and a cooling flow path used for stacking a plurality of semiconductor chips
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.