Patent Assignment
Reel/Frame 047739/0213
Assignment of Assignor's Interest
Recorded: 2018-12-11
Pages: 12
Assignors
PADMANABHAN, BALAJI
Executed: 2015-09-11
VENKATRAMAN, PRASAD
Executed: 2015-09-11
HOSSAIN, ZIA
Executed: 2015-09-11
MCDONALD, JASON
Executed: 2018-09-14
SALIH, ALI
Executed: 2015-09-11
YOUNG, ALEXANDER
Executed: 2015-09-11
LIU, CHUN-LI
Executed: 2015-09-09
Assignee
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
5005 E. MCDOWELL ROAD, MAILDROP A700, PHOENIX, ARIZONA, 85008
Covered Property
(1)
Method of Forming a Heterojunction Semiconductor Device Having Integrated Clamping Device
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest
Feb 13, 2019
From: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC; FAIRCHILD SEMICONDUCTOR CORPORATION
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 048327/0670 →
Release of Security Interest in Patents Recorded at Reel 048327, Frame 0670
Jun 23, 2023
From: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC; FAIRCHILD SEMICONDUCTOR CORPORATION
Reel/Frame 064079/0001 →