Patent Assignment
Reel/Frame 047740/0382
Assignment of Assignor's Interest
Recorded: 2018-12-11
Pages: 16
Assignors
MATOVU, JOHN B.
Executed: 2018-01-08
MEYAARD, DAVID S.
Executed: 2018-01-04
DAMARLA, GOWRISANKAR
Executed: 2018-01-10
VEGUNTA, SRI SAI SIVAKUMAR
Executed: 2018-01-22
SHROTRI, KUNAL
Executed: 2018-07-28
SARAF, SHASHANK
Executed: 2018-01-23
GAST, KEVIN R.
Executed: 2018-01-08
JHOTHIRAMAN, JIVAAN KISHORE
Executed: 2018-01-08
RAMARAJAN, SURESH
Executed: 2018-07-28
XU, LIFANG
Executed: 2018-12-03
BHONSLE, RITHU K.
Executed: 2018-01-08
NARULKAR, RUTUPARNA
Executed: 2018-05-08
KING, MATTHEW J.
Executed: 2018-07-27
Assignee
MICRON TECHNOLOGY, INC.
8000 SOUTH FEDERAL WAY, MAILSTOP 1-507, BOISE, IDAHO, 83707-0006
Covered Property
(1)
Methods of Forming Semiconductor Structures Having Stair Step Structures
Patent:
10,269,625 →
Application:
15/857,197 →
Related Assignments
(4)
Other recorded transfers of the patent in this record — the chain of ownership.
Supplement No. 7 to Patent Security Agreement
Feb 6, 2018
From: MICRON TECHNOLOGY, INC.
To: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
Reel/Frame 045267/0833 →
Security Interest
Jul 13, 2018
From: MICRON TECHNOLOGY, INC.; MICRON SEMICONDUCTOR PRODUCTS, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 047540/0001 →
Release of Security Interest
Oct 10, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.
Reel/Frame 050716/0678 →
Release of Security Interest
Nov 12, 2019
From: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.; MICRON SEMICONDUCTOR PRODUCTS, INC.
Reel/Frame 051028/0001 →