Patent Assignment
Reel/Frame 047760/0467
Assignment of Assignor's Interest
Recorded: 2018-12-13
Pages: 4
Assignors
HUANG, SHIH-YA
Executed: 2018-11-23
TSAI, CHUNG-HAO
Executed: 2018-11-23
YU, CHEN-HUA
Executed: 2018-11-23
WANG, CHUEI-TANG
Executed: 2018-11-23
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK,, HSINCHU, 30078, TAIWAN
Covered Property
(1)
Package Structure and Method of Manufacturing the Same