Patent Assignment
Reel/Frame 047814/0983
Assignment of Assignor's Interest
Recorded: 2018-12-19
Pages: 5
Assignors
KIM, TAEHYEONG
Executed: 2018-12-07
KIM, YOUNG LYONG
Executed: 2018-12-07
NAM, GEOL
Executed: 2018-12-07
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, GYEONGGI-DO, SUWON-SI, 16677,, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Package and Method of Manufacturing the Same