Patent Assignment
Reel/Frame 047820/0311
Assignment of Assignor's Interest
Recorded: 2018-12-19
Pages: 8
Assignors
FROST, DENZIL S.
Executed: 2018-11-28
HOUSLEY, RICHARD T.
Executed: 2018-11-27
ZHOU, JIANMING
Executed: 2018-12-08
Assignee
MICRON TECHNOLOGY, INC.
8000 SOUTH FEDERAL WAY, MS 1- 525, BOISE, IDAHO, 83716
Covered Property
(1)
Integrated-Circuitry Overlay Alignment Mark, A Substrate Comprising An Overlay Alignment Mark, A Method Of Forming An Overlay Alignment Mark In The Fabrication Of Integrated Circuitry, And A Method Of Determining Overlay Alignment In The Fabrication Of Integrated Circuitry
Related Assignments
(4)
Other recorded transfers of the patent in this record — the chain of ownership.
Supplement No. 12 to Patent Security Agreement
Apr 19, 2019
From: MICRON TECHNOLOGY, INC.
To: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
Reel/Frame 048948/0677 →
Supplement No. 3 to Patent Security Agreement
Apr 19, 2019
From: MICRON TECHNOLOGY, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 048951/0902 →
Release of Security Interest
Oct 14, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.
Reel/Frame 050724/0392 →
Release of Security Interest
Nov 15, 2019
From: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.
Reel/Frame 051041/0317 →