Patent Assignment
Reel/Frame 047864/0185
Assignment of Assignor's Interest
Recorded: 2018-12-28
Pages: 4
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK,, HSINCHU, 30078, TAIWAN
Covered Property
(1)
Package Contact Structure, Semiconductor Package and Manufacturing Method Thereof