Patent Assignment
Reel/Frame 047866/0729
Assignment of Assignor's Interest
Recorded: 2018-12-28
Pages: 5
Assignors
OHTOU, TETSU
Executed: 2017-03-06
ONIKI, YUSUKE
Executed: 2017-02-20
FUJIWARA, HIDEHIRO
Executed: 2017-02-10
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSINCHU, 300, TAIWAN
Covered Property
(1)
Method for Fabricating Semiconductor Device Having Buried Metal Line