Patent Assignment
Reel/Frame 047886/0469
Assignment of Assignor's Interest
Recorded: 2019-01-03
Pages: 3
Assignee
AGC INC.
5-1, MARUNOUCHI 1-CHOME, CHIYODA-KU, TOKYO, 100-8405, JAPAN
Covered Property
(1)
Wiring Substrate and Process for Producing It