IP Library › Assignment 047907/0237
Patent Assignment
Reel/Frame 047907/0237

Assignment of Assignor's Interest

Recorded: 2019-01-04 Pages: 4
Assignors
CHEN, MIIN-JANG
Executed: 2018-12-18
YI, SHENG-HAN
Executed: 2018-12-17
LU, CHEN-HSUAN
Executed: 2018-12-16
Assignees
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO.8, LI-HSIN RD.6, SCIENCE-BASED INDUSTRIAL PARK, HSINCHU, 300, TAIWAN
NATIONAL TAIWAN UNIVERSITY
NO.1, SEC. 4, ROOSEVELT ROAD, TAIPEI, 10617, TAIWAN
Covered Property (1)
Semiconductor Device and Forming Method Thereof
Application: 16/232,932 →
Publication: US 2020/0035807
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Dec 27, 2018
From: CHEN, MIIN-JANG; YI, SHENG-HAN; LU, CHEN-HSUAN
To: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
Reel/Frame 047861/0418 →