IP Library › Assignment 047919/0441
Patent Assignment
Reel/Frame 047919/0441

Assignment of Assignor's Interest

Recorded: 2019-01-07 Pages: 3
Assignors
TANG, LAI GUAN
Executed: 2018-12-26
TEH, HUP CHIN
Executed: 2018-12-26
JONG, KIUN KIET
Executed: 2018-12-26
Assignee
INTEL CORPORATION
2200 MISSION COLLEGE BOULEVARD, SANTA CLARA, CALIFORNIA, 95054
Covered Property (1)
Scalable Micro Bumps Indexing and Redundancy Scheme for Homogeneous Configurable Integrated Circuit Dies
Application: 16/233,431 →
Publication: US 2019/0158096
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Jan 19, 2024
From: INTEL CORPORATION
To: ALTERA CORPORATION
Reel/Frame 066353/0886 →
Security Interest Sep 12, 2025
From: ALTERA CORPORATION
To: BARCLAYS BANK PLC, AS COLLATERAL AGENT
Reel/Frame 073431/0309 →