IP Library Assignment 047960/0894
Patent Assignment
Reel/Frame 047960/0894

Assignment of Assignor's Interest

Recorded: 2019-01-10 Pages: 3
Assignors
UZOH, CYPRIAN EMEKA
Executed: 2015-08-31
KATKAR, RAJESH
Executed: 2015-08-28
Assignee
INVENSAS CORPORATION
3025 ORCHARD PARKWAY, SAN JOSE, CALIFORNIA, 95134
Covered Property (1)
Multiple Plated via Arrays of Different Wire Heights on Same Substrate
Application: 16/245,116 →
Publication: US 2019/0148344
Related Assignments (3)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest Jun 1, 2020
From: ROVI SOLUTIONS CORPORATION; ROVI TECHNOLOGIES CORPORATION; ROVI GUIDES, INC.; TIVO SOLUTIONS INC.
To: BANK OF AMERICA, N.A.
Reel/Frame 053468/0001 →
Change of Name Nov 24, 2025
From: INVENSAS LLC
To: ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
Reel/Frame 073508/0661 →
Change of Name Nov 24, 2025
From: INVENSAS CORPORATION
To: INVENSAS LLC
Reel/Frame 073689/0793 →