Patent Assignment
Reel/Frame 047963/0170
Assignment of Assignor's Interest
Recorded: 2019-01-11
Pages: 2
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Interconnect Structures and Methods of Forming the Same