Patent Assignment
Reel/Frame 047970/0609
Assignment of Assignor's Interest
Recorded: 2019-01-11
Pages: 3
Assignor
YANG, CHIH-CHAO
Executed: 2017-02-13
Assignee
INTERNATIONAL BUSINESS MACHINES CORPORATION
NEW ORCHARD ROAD, ARMONK, NEW YORK, 10504
Covered Property
(1)
Microstructure Modulation for Metal Wafer-Wafer Bonding
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.