IP Library › Assignment 048030/0272
Patent Assignment
Reel/Frame 048030/0272

Assignment of Assignor's Interest

Recorded: 2019-01-16 Pages: 2
Assignors
SUZUKI, TOMOHISA
Executed: 2018-11-30
TERASAKI, TAKESHI
Executed: 2018-11-29
Assignee
HITACHI, LTD.
6-6, MARUNOUCHI 1-CHOME, CHIYODA-KU,, TOKYO, 100-8280, JAPAN
Covered Property (1)
Semiconductor Module and Method for Manufacturing Semiconductor Module
Application: 16/318,194 →
Publication: US 2019/0287896