Patent Assignment
Reel/Frame 048055/0104
Assignment of Assignor's Interest
Recorded: 2019-01-18
Pages: 3
Assignor
LEE, JUN-KYU
Executed: 2019-01-15
Assignee
NEPES CO., LTD.
105, GEUMIL-RO 965BEON-GIL, SAMSEONG-MYEON,, EUMSEONG-GUN, CHUNGCHEONGBUK-DO 27651, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Package and Method of Manufacturing the Same