Patent Assignment
Reel/Frame 048067/0261
Assignment of Assignor's Interest
Recorded: 2019-01-21
Pages: 10
Assignors
WU, WEN-HAU
Executed: 2018-12-21
CHUANG, CHUN-HAO
Executed: 2018-12-25
HASHIMOTO, KAZUAKI
Executed: 2018-12-24
CHOU, KENG-YU
Executed: 2018-12-21
CHIANG, WEI-CHIEH
Executed: 2018-12-25
HUANG, CHENG YU
Executed: 2018-12-21
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO. 8, LI-HSIN RD. 6, HSIN-CHU SCIENCE PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Wafer Level Image Sensor Package