IP Library Assignment 048078/0646
Patent Assignment
Reel/Frame 048078/0646

Change of Name

Recorded: 2019-01-16 Pages: 3
Assignor
ENTHONE INC.
Executed: 2016-06-27
Assignee
MACDERMID ENTHONE INC.
245 FREIGHT STREET, WATERBURY, CONNECTICUT, 06702
Covered Property (1)
Copper Filling of Through Silicon Vias
Application: 13/699,910 →
Publication: US 2013/0199935
Related Assignments (5)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Dec 5, 2012
From: RICHARDSON, THOMAS B.; SHAO, WENBO; LIN, XUAN; WANG, CAI
To: ENTHONE INC.
Reel/Frame 029412/0272 →
Patent Security Agreement Apr 15, 2016
From: ENTHONE INC.
To: BARCLAYS BANK PLC, AS COLLATERAL AGENT
Reel/Frame 038439/0777 →
Release of Security Interest Feb 4, 2019
From: BARCLAYS BANK PLC, AS COLLATERAL AGENT
To: MACDERMID ENTHONE INC. (F/K/A ENTHONE INC.)
Reel/Frame 048233/0141 →
Security Interest Feb 5, 2019
From: MACDERMID ENTHONE INC. (F/K/A ENTHONE INC.)
To: BARCLAYS BANK PLC, AS COLLATERAL AGENT
Reel/Frame 048261/0110 →
Assignment of Security Interest in Patent Collateral Nov 17, 2022
From: BARCLAYS BANK PLC
To: CITIBANK, N.A.
Reel/Frame 061956/0643 →