Patent Assignment
Reel/Frame 048084/0331
Assignment of Assignor's Interest
Recorded: 2019-01-22
Pages: 6
Assignors
JI, ZHONGLI
Executed: 2018-12-14
YE, NING
Executed: 2019-01-03
ZHANG, TONG
Executed: 2019-01-03
TAKIAR, HEM
Executed: 2019-01-03
LIU, YANGMING
Executed: 2018-12-24
Assignee
SANDISK TECHNOLOGIES LLC
5080 SPECTRUM DRIVE, SUITE 1050W, ADDISON, TEXAS, 75001
Covered Property
(1)
Semiconductor Die Singulation Using a Sacrificial Bonding Material Layer and an Anisotropic Channel Etch
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Dec 31, 2024
From: SANDISK TECHNOLOGIES LLC
To: SANDISK TECHNOLOGIES, INC.
Reel/Frame 069796/0423 →
Security Agreement
Apr 25, 2025
From: SANDISK TECHNOLOGIES, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 071050/0001 →
Partial Release of Security Interests
Apr 25, 2025
From: JPMORGAN CHASE BANK, N.A., AS AGENT
To: SANDISK TECHNOLOGIES, INC.
Reel/Frame 071382/0001 →