Patent Assignment
Reel/Frame 048094/0863
Assignment of Assignor's Interest
Recorded: 2019-01-22
Pages: 3
Assignor
TATSUMI, KOHEI
Executed: 2018-12-15
Assignee
WASEDA UNIVERSITY
104 TOTSUKAMACHI 1-CHOME, SHINJUKU-KU, TOKYO, 169-8050, JAPAN
Covered Property
(1)
Power Semiconductor Module Device