IP Library › Assignment 048104/0504
Patent Assignment
Reel/Frame 048104/0504

Assignment of Assignor's Interest

Recorded: 2018-11-16 Pages: 4
Assignor
ZHOU, FEI
Executed: 2018-10-12
Assignees
SEMICONDUCTOR MANUFACTURING INTERNATIONAL (SHANGHAI) CORPORATION
18 ZHANGJIANG ROAD, PUDONG NEW AREA, SHANGHAI, CHINA
SMIC NEW TECHNOLOGY RESEARCH AND DEVELOPMENT (SHANGHAI) CORPORATION
18 ZHANGJIANG ROAD, PUDONG NEW AREA, SHANGHAI, CHINA
Covered Property (1)
Fabrication Method of Semiconductor Device by Removing Sacrificial Layer on Gate Structures
Application: 16/193,137 →
Publication: US 2019/0164831
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Oct 29, 2025
From: SEMICONDUCTOR MANUFACTURING INTERNATIONAL (SHANGHAI) CORPORATION; SMIC NEW TECHNOLOGY RESEARCH AND DEVELOPMENT (SHANGHAI) CORPORATION
To: SEMICONDUCTOR MANUFACTURING INTERNATIONAL (SHANGHAI) CORPORATION
Reel/Frame 072716/0862 →