IP Library Assignment 072716/0862
Patent Assignment
Reel/Frame 072716/0862

Assignment of Assignor's Interest

Recorded: 2025-10-29 Pages: 5
Covered Properties (25)
Method for Making Semiconductor Structure Having Mis Contact
Application: 16/046,799 →
Publication: US 2019/0035693
Semiconductor Structure with Protection Layer and Fabrication Method Thereof
Application: 16/105,562 →
Publication: US 2019/0067447
Semiconductor Structure and Fabrication Method Thereof
Application: 16/105,670 →
Publication: US 2019/0067434
Semiconductor Structures and Fabrication Methods Thereof
Application: 16/105,758 →
Publication: US 2019/0067123
Semiconductor Structure and Fabrication Method Thereof
Application: 16/106,222 →
Publication: US 2019/0067286
Semiconductor Structures and Fabrication Methods Thereof
Application: 16/114,857 →
Publication: US 2019/0067467
Semiconductor Structures and Fabrication Methods Thereof
Application: 16/115,151 →
Publication: US 2019/0067155
Semiconductor Structure and Fabrication Method Thereof
Application: 16/117,451 →
Publication: US 2019/0122932
Semiconductor Structure and Fabrication Method Thereof
Application: 16/117,634 →
Publication: US 2019/0103318
Semiconductor Device and Fabrication Method Thereof
Application: 16/117,804 →
Publication: US 2019/0148235
Semiconductor Structure and Fabrication Method Thereof
Application: 16/117,956 →
Publication: US 2019/0097020
Fabrication Method for Fin-Based Semiconductor Device
Application: 16/118,010 →
Publication: US 2019/0157136
Fabrication Method of Semiconductor Device by Removing Sacrificial Layer on Gate Structures
Application: 16/193,137 →
Publication: US 2019/0164831
Semiconductor Device and Fabrication Method Thereof
Application: 16/200,930 →
Publication: US 2019/0172754
Semiconductor Device and Fabrication Method Thereof
Application: 16/234,038 →
Publication: US 2019/0206739
Semiconductor Device and Fabrication Method Thereof
Application: 16/234,340 →
Publication: US 2019/0206742
Semiconductor Device and Fabrication Method Thereof
Application: 16/234,753 →
Publication: US 2019/0206853
Semiconductor Structure Having a Repaired Dielectric Layer
Application: 16/702,688 →
Publication: US 2020/0105611
Semiconductor Device
Application: 16/861,617 →
Publication: US 2020/0258787
Semiconductor Structure with Protection Layer
Application: 16/895,060 →
Publication: US 2020/0303515
Semiconductor Structure
Application: 17/007,579 →
Publication: US 2020/0395457
Semiconductor Structure
Application: 17/019,956 →
Publication: US 2020/0411519
Semiconductor Device
Application: 17/061,089 →
Publication: US 2021/0028161
Semiconductor Structure
Application: 17/061,200 →
Publication: US 2021/0020518
Semiconductor Device with Fins
Application: 17/247,984 →
Publication: US 2021/0125876
Related Assignments (17)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Jul 26, 2018
From: LI, YONG
To: SEMICONDUCTOR MANUFACTURING INTERNATIONAL (SHANGHAI) CORPORATION; SMIC NEW TECHNOLOGY RESEARCH AND DEVELOPMENT (SHANGHAI) CORPORATION
Reel/Frame 046475/0010 →
Assignment of Assignor's Interest Aug 21, 2018
From: LI, YONG
To: SEMICONDUCTOR MANUFACTURING INTERNATIONAL (SHANGHAI) CORPORATION; SMIC NEW TECHNOLOGY RESEARCH AND DEVELOPMENT (SHANGHAI) CORPORATION
Reel/Frame 046640/0221 →
Assignment of Assignor's Interest Aug 21, 2018
From: ZHOU, FEI
To: SEMICONDUCTOR MANUFACTURING INTERNATIONAL (SHANGHAI) CORPORATION; SMIC NEW TECHNOLOGY RESEARCH AND DEVELOPMENT (SHANGHAI) CORPORATION
Reel/Frame 046867/0017 →
Assignment of Assignor's Interest Aug 21, 2018
From: ZHOU, FEI
To: SEMICONDUCTOR MANUFACTURING INTERNATIONAL (SHANGHAI) CORPORATION; SMIC NEW TECHNOLOGY RESEARCH AND DEVELOPMENT (SHANGHAI) CORPORATION
Reel/Frame 046867/0707 →
Assignment of Assignor's Interest Aug 21, 2018
From: ZHOU, FEI
To: SEMICONDUCTOR MANUFACTURING INTERNATIONAL (SHANGHAI) CORPORATION; SMIC NEW TECHNOLOGY RESEARCH AND DEVELOPMENT (SHANGHAI) CORPORATION
Reel/Frame 046866/0516 →
Assignment of Assignor's Interest Aug 28, 2018
From: ZHOU, FEI
To: SEMICONDUCTOR MANUFACTURING INTERNATIONAL (SHANGHAI) CORPORATION; SMIC NEW TECHNOLOGY RESEARCH AND DEVELOPMENT (SHANGHAI) CORPORATION
Reel/Frame 046961/0546 →
Assignment of Assignor's Interest Aug 28, 2018
From: ZHOU, FEI
To: SEMICONDUCTOR MANUFACTURING INTERNATIONAL (SHANGHAI) CORPORATION; SMIC NEW TECHNOLOGY RESEARCH AND DEVELOPMENT (SHANGHAI) CORPORATION
Reel/Frame 047318/0551 →
Assignment of Assignor's Interest Aug 30, 2018
From: ZHOU, FEI
To: SEMICONDUCTOR MANUFACTURING INTERNATIONAL (SHANGHAI) CORPORATION; SMIC NEW TECHNOLOGY RESEARCH AND DEVELOPMENT (SHANGHAI) CORPORATION
Reel/Frame 046986/0217 →
Assignment of Assignor's Interest Aug 30, 2018
From: WANG, QING PENG
To: SEMICONDUCTOR MANUFACTURING INTERNATIONAL (SHANGHAI) CORPORATION; SMIC NEW TECHNOLOGY RESEARCH AND DEVELOPMENT (SHANGHAI) CORPORATION
Reel/Frame 046758/0564 →
Assignment of Assignor's Interest Aug 30, 2018
From: ZHOU, FEI
To: SEMICONDUCTOR MANUFACTURING INTERNATIONAL (SHANGHAI) CORPORATION; SMIC NEW TECHNOLOGY RESEARCH AND DEVELOPMENT (SHANGHAI) CORPORATION
Reel/Frame 046760/0461 →
Assignment of Assignor's Interest Aug 30, 2018
From: ZHOU, FEI
To: SEMICONDUCTOR MANUFACTURING INTERNATIONAL (SHANGHAI) CORPORATION; SMIC NEW TECHNOLOGY RESEARCH AND DEVELOPMENT (SHANGHAI) CORPORATION
Reel/Frame 047570/0350 →
Assignment of Assignor's Interest Aug 30, 2018
From: WANG, QING PENG
To: SEMICONDUCTOR MANUFACTURING INTERNATIONAL (SHANGHAI) CORPORATION; SMIC NEW TECHNOLOGY RESEARCH AND DEVELOPMENT (SHANGHAI) CORPORATION
Reel/Frame 046986/0684 →
Assignment of Assignor's Interest Nov 16, 2018
From: ZHOU, FEI
To: SEMICONDUCTOR MANUFACTURING INTERNATIONAL (SHANGHAI) CORPORATION; SMIC NEW TECHNOLOGY RESEARCH AND DEVELOPMENT (SHANGHAI) CORPORATION
Reel/Frame 048104/0504 →
Assignment of Assignor's Interest Nov 27, 2018
From: ZHANG, CHENG LONG
To: SEMICONDUCTOR MANUFACTURING INTERNATIONAL (SHANGHAI) CORPORATION; SMIC NEW TECHNOLOGY RESEARCH AND DEVELOPMENT (SHANGHAI) CORPORATION
Reel/Frame 047646/0880 →
Assignment of Assignor's Interest Dec 27, 2018
From: WANG, ZHI DONG; ZHANG, CHENG LONG; TU, WU TAO
To: SEMICONDUCTOR MANUFACTURING INTERNATIONAL (SHANGHAI) CORPORATION; SMIC NEW TECHNOLOGY RESEARCH AND DEVELOPMENT (SHANGHAI) CORPORATION
Reel/Frame 049038/0334 →
Assignment of Assignor's Interest Dec 27, 2018
From: ZHOU, FEI
To: SEMICONDUCTOR MANUFACTURING INTERNATIONAL (SHANGHAI) CORPORATION; SMIC NEW TECHNOLOGY RESEARCH AND DEVELOPMENT (SHANGHAI) CORPORATION
Reel/Frame 049039/0072 →
Assignment of Assignor's Interest Dec 28, 2018
From: ZHANG, XIN GUI; DONG, YAO QI
To: SEMICONDUCTOR MANUFACTURING INTERNATIONAL (SHANGHAI) CORPORATION; SMIC NEW TECHNOLOGY RESEARCH AND DEVELOPMENT (SHANGHAI) CORPORATION
Reel/Frame 047992/0932 →