Semiconductor structure with protection layer
Semiconductor structure is provided. The semiconductor structure includes at least one fin on a semiconductor substrate; at least one stacked channel layer formed on the at least one fin, each stacked channel layer having a sacrificial layer and a channel layer on the sacrificial layer; a dummy gate structure formed on the dummy gate structure; openings formed in the at least one stacked channel layer at both sides of the dummy gate structure; and a protective layer formed on sidewall surfaces of the sacrificial layer.
1. A semiconductor structure, comprising:
at least one fin on a semiconductor substrate;
at least one stacked channel layer formed on the at least one fin, each stacked channel layer having a sacrificial layer and a channel layer on the sacrificial layer;
an all-around gate structure formed on the at least one stacked channel layer;
lightly doped regions formed in the at least one stacked channel layer at both sides of the all-around gate structure;
openings formed in the at least one stacked channel layer at both sides of the all-around gate structure;
a protective layer formed on sidewall surfaces of each sacrificial layer, wherein each protective layer is sandwiched by adjacent channel layers and a topmost layer of the at least one stacked channel layer is a corresponding channel layer; and
a stress layer formed in each of the openings covering a sidewall of the protective layer and a sidewall of the channel layer, wherein each of the sacrificial layer is divided by the protective layer and the stress layer into at least two sections.
2. The semiconductor structure according to claim 1 , wherein:
the protective layer is made of Si.
3. The semiconductor structure according to claim 1 , wherein:
a width of the protective layer is in a range of approximately 10 Å-300 Å.
4. The semiconductor structure according to claim 1 , wherein:
the semiconductor structure is a PMOS transistor.
5. The semiconductor structure according to claim 1 , further comprising:
sidewall spacers formed on sidewall surfaces of the all-around gate structure,
wherein the protective layer is under the sidewall spacers and a width of the protective layer is smaller than or equal to a thickness of the sidewall spacers.
6. The semiconductor structure according to claim 1 , further comprising:
a stress layer formed in the openings.
7. The semiconductor structure according to claim 1 , wherein:
the sacrificial layer is made of SiGe; and
the semiconductor structure is PMOS transistor.
8. The semiconductor structure according to claim 1 , wherein:
the protective layer has a sidewall surface coplanar with a sidewall surface of the sacrificial layer.
9. The semiconductor structure according to claim 8 , wherein:
the openings expose the sidewall surface of the protective layer and the sidewall surface of the channel layer.
10. The semiconductor structure according to claim 1 , wherein:
the protective layer completely covers sidewall surfaces of the channel layer directly under the all-around gate structure.
11. The semiconductor structure according to claim 1 , wherein:
the lightly doped regions is located on a side of the openings close to the all-around gate structure.
12. The semiconductor structure according to claim 1 , wherein:
the all-around gate structure is directly formed on a top channel layer of the at least one stacked channel layer.
13. The semiconductor structure according to claim 12 , wherein:
the lightly doped regions are located within the top channel layer of the at least one stacked channel layer, and
the size of the lightly doped regions along the extending direction of the at least one fin is the diffusion length of doped ions into the top channel layer.