Patent Assignment
Reel/Frame 048146/0451
Assignment of Assignor's Interest
Recorded: 2019-01-28
Pages: 6
Assignors
KUO, TIN-HAO
Executed: 2019-01-18
YU, CHEN-HUA
Executed: 2019-01-22
LIU, CHUNG-SHI
Executed: 2019-01-18
TSAI, HAO-YI
Executed: 2019-01-18
LAI, YU-CHIA
Executed: 2019-01-18
TENG, PO-YUAN
Executed: 2019-01-18
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, , TAIWAN 300-78, R.O.C., 30078, TAIWAN
Covered Property
(1)
Semiconductor Device, Circuit Board Structure and Manufacturing Method Thereof