Semiconductor device, circuit board structure and manufacturing method thereof
A semiconductor device, a circuit board structure and a manufacturing forming thereof are provided. A circuit board structure includes a core layer, a first build-up layer and a second build-up layer. The first build-up layer and the second build-up layer are disposed on opposite sides of the core layer. The circuit board structure has a plurality of stress releasing trenches extending into the first build-up layer and the second build-up layer.
1. A semiconductor device, comprising:
a circuit board structure, comprising:
a core layer; and
a first build-up layer and a second build-up layer disposed on opposite sides of the core layer, wherein the circuit board structure has a plurality of stress releasing trenches extending into the first build-up layer and the second build-up layer;
a plurality of semiconductor chips bonded to the circuit board structure; and
a redistribution layer structure disposed between the plurality of semiconductor chips and the circuit board structure,
wherein a location of the stress releasing trenches is overlapped with a location of some of conductive patterns of the redistribution layer structure.
2. The semiconductor device of claim 1 , wherein the stress releasing trenches comprise a plurality of first trenches and a plurality of second trenches respectively penetrate through the first build-up layer and the second build-up layer.
3. The semiconductor device of claim 2 , wherein the first trenches and the second trenches further penetrate through the core layer.
4. The semiconductor device of claim 1 , wherein at least some of the stress releasing trenches are parallel to an edge of the circuit board structure.
5. The semiconductor device of claim 1 , wherein at least some of the stress releasing trenches are not parallel to an edge of the circuit board structure.
6. The semiconductor device of claim 1 , wherein the stress releasing trenches are arranged regularly.
7. The semiconductor device of claim 1 , wherein the stress releasing trenches are arranged more in a corner region of the circuit board structure and arranged less in a center region of the circuit board structure.
8. The semiconductor device of claim 1 , wherein the stress releasing trenches are configured at single side of the circuit board structure.
9. The semiconductor device of claim 1 , further comprising a soft material disposed in the stress releasing trenches.
10. A semiconductor device, comprising:
a circuit board structure having conductive patterns therein;
a plurality of semiconductor chips bonded to the circuit board structure; and
an encapsulation layer disposed between the semiconductor chips,
wherein the circuit board structure has a plurality of stress releasing trenches corresponding to a location of the encapsulation layer between the semiconductor chips, and the stress releasing trenches are spaced from the encapsulation layer between the semiconductor chips.
11. The semiconductor device of claim 10 , wherein the circuit board structure comprises a core layer, and a first build-up layer and a second build-up layer disposed on opposite sides of the core layer, and wherein the stress releasing trenches have a plurality of first trenches extending from a first side of the first build-up layer and a plurality of second trenches extending from a second side of the second build-up layer, and the first side is opposite to the second side.
12. The semiconductor device of claim 11 , wherein the first trenches and the second trenches further penetrate through the core layer.
13. The semiconductor device of claim 10 , wherein the stress releasing trenches are arranged regularly.
14. The semiconductor device of claim 10 , wherein the stress releasing trenches are arranged more in a corner region of the circuit board structure and arranged less in a center region of the circuit board structure.
15. The semiconductor device of claim 10 , wherein the circuit board structure is a coreless circuit board structure.
16. A semiconductor device, comprising:
a circuit board structure, comprising:
a core layer; and
a first build-up layer and a second build-up layer disposed on opposite sides of the core layer, wherein the circuit board structure has a plurality of first trenches and a plurality of second trenches respectively penetrate through the first build-up layer and the second build-up layer; and
a plurality of semiconductor chips bonded to the circuit board structure,
wherein a location of the plurality of first trenches and a location the plurality of second trenches are separated from a location of all of conductive patterns of the first build-up layer and the second build-up layer, and
wherein the semiconductor device further comprises an encapsulation layer disposed between the semiconductor chips and covering the plurality of first trenches and the plurality of second trenches.
17. The semiconductor device of claim 16 , further comprising a redistribution layer structure disposed between the plurality of semiconductor chips and the circuit board structure.
18. The semiconductor device of claim 17 , wherein the location of the plurality of first trenches and the location of the plurality of second trenches are overlapped with a location of some of conductive patterns of the redistribution layer structure.
19. The semiconductor device of claim 16 , wherein some of the plurality of semiconductor chips are dummy chips.
20. The semiconductor device of claim 16 , further comprising a soft material disposed in the plurality of first trenches and the plurality of second trenches.