IP Library Assignment 048174/0498
Patent Assignment
Reel/Frame 048174/0498

Change of Name

Recorded: 2019-01-25 Pages: 12
Assignor
XTPL SP.
Executed: 2016-06-01
Assignee
XTPL S.A.
STABLOWICKA 147, WROCLAW, 54-066, POLAND
Covered Property (1)
Bottom-Up Method for Forming Wire Structures Upon a Substrate
Application: 16/087,462 →
Publication: US 2019/0106804
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Jan 31, 2019
From: GRANEK, FILIP
To: XTPL S.A.
Reel/Frame 048208/0524 →
Employee Agreement Jul 22, 2019
From: ROZYNEK, ZBIGNIEW JERZY
To: XTPL SP.
Reel/Frame 049821/0103 →