IP Library Assignment 048208/0524
Patent Assignment
Reel/Frame 048208/0524

Assignment of Assignor's Interest

Recorded: 2019-01-31 Pages: 5
Assignor
GRANEK, FILIP
Executed: 2019-01-31
Assignee
XTPL S.A.
STABLOWICKA 147, WROCLAW, 54-066, POLAND
Covered Property (1)
Bottom-Up Method for Forming Wire Structures Upon a Substrate
Application: 16/087,462 →
Publication: US 2019/0106804
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name Jan 25, 2019
From: XTPL SP.
To: XTPL S.A.
Reel/Frame 048174/0498 →
Employee Agreement Jul 22, 2019
From: ROZYNEK, ZBIGNIEW JERZY
To: XTPL SP.
Reel/Frame 049821/0103 →