Patent Assignment
Reel/Frame 048175/0596
Assignment of Assignor's Interest
Recorded: 2019-01-28
Pages: 3
Assignor
ARCEDERA, ADRIAN
Executed: 2016-02-01
Assignee
AMKOR TECHNOLOGY, INC.
2045 E. INNOVATION CIRCLE, TEMPE, ARIZONA, 85284
Covered Property
(1)
Semiconductor Package Using a Polymer Substrate
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Jan 28, 2019
From: LEE, YUNG WOO; KIM, BYUNG JUN; BANG, DONG HYUN; CHO, EUNNARA
To: AMKOR TECHNOLOGY, INC.
Reel/Frame 048180/0062 →
Assignment of Assignor's Interest
Nov 19, 2020
From: AMKOR TECHNOLOGY, INC.
To: AMKOR TECHNOLOGY SINGAPORE HOLDING PTE. LTD.
Reel/Frame 054482/0302 →