Patent Assignment
Reel/Frame 048180/0062
Assignment of Assignor's Interest
Recorded: 2019-01-28
Pages: 8
Assignors
LEE, YUNG WOO
Executed: 2016-02-01
KIM, BYUNG JUN
Executed: 2016-02-04
BANG, DONG HYUN
Executed: 2016-02-02
CHO, EUNNARA
Executed: 2016-02-01
LEE, JAE UNG
Executed: 2016-02-01
Assignee
AMKOR TECHNOLOGY, INC.
2045 E. INNOVATION CIRCLE, TEMPE, ARIZONA, 85284
Covered Property
(1)
Semiconductor Package Using a Polymer Substrate
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.