Semiconductor package using a polymer substrate
A semiconductor package using a polymer substrate is disclosed and may include a polymer cavity structure comprising first metal traces, a micro-electro mechanical systems (MEMS) device and a semiconductor die bonded to a first surface within a cavity of the cavity structure, and a substrate coupled to the cavity structure and comprising second metal traces coupled to the first metal traces. The substrate may enclose the MEMS device and the semiconductor die. Ground traces may be on external surfaces of the polymer cavity structure. Ball lands may be on a surface of the substrate opposite to a surface with the second metal traces. The first metal traces may extend from the first surface of the polymer cavity structure up a sidewall of the cavity and to conductive patterns on a top surface of the polymer cavity structure.
1. A semiconductor device, comprising:
a first substrate comprising an inner surface and an outer surface;
a polymer substrate comprising:
sidewalls, each sidewall comprising a top surface coupled to the inner surface of the first substrate;
a cavity comprising a cavity bottom surface and cavity sidewall surfaces, wherein the cavity sidewall surfaces are provided by inner surfaces of the sidewalls;
a ground path on an outer surface of a first sidewall of the sidewalls, the inner surface and the outer surface of the first sidewall defining a thickness of the first sidewall; and
a signal trace that extends on the cavity bottom surface and that extends on the inner surface of the first sidewall;
a micro-electro mechanical systems (MEMS) device within the cavity of the polymer substrate; and
a semiconductor die within the cavity of the polymer substrate and electrically coupled to the MEMS device and the signal trace.
2. The semiconductor device of claim 1 , wherein a signal output of the semiconductor die is electrically coupled the signal trace.
3. The semiconductor device of claim 1 , wherein the signal trace comprises:
a first surface in direct contact with the inner surface of the first sidewall; and
a second surface, opposite the first surface, that is exposed.
4. The semiconductor device of claim 1 , wherein the ground path is laterally bounded by portions of the outer surface of the first sidewall.
5. The semiconductor device of claim 1 , wherein the MEMS device and the semiconductor die are mounted to the cavity bottom surface.
6. The semiconductor device of claim 1 , further comprising:
a first wire bond that electrically couples the semiconductor die to the signal trace; and
a second wire bond that electrically couples the MEMS device to the semiconductor die.
7. The semiconductor device of claim 1 , wherein a portion of the signal trace lies on the top surface of the first sidewall.
8. The semiconductor device of claim 7 , further comprising:
a conductive pattern on the inner surface of the first substrate, the conductive pattern coupled to the portion of the signal trace on the top surface of the first sidewall;
a conductive land on the outer surface of the first substrate; and
a conductive via through the first substrate that couples the conductive land to the conductive pattern.
9. The semiconductor device of claim 8 , wherein:
the first substrate comprises a first ground path layer on its inner surface;
the polymer substrate comprises a second ground path layer on its a top surface of the polymer substrate; and
the first ground path layer contacts the second ground path layer.
10. The semiconductor device of claim 9 , further comprising a ground shield layer that traverses the cavity bottom surface and that is coupled to first ground path layer of the first substrate via the second ground path layer of the polymer substrate.
11. A semiconductor device, comprising:
a polymer structure comprising a cavity defined by a cavity bottom surface and sidewall inner surfaces provided by sidewalls of the polymer structure;
a micro-electro mechanical systems (MEMS) device within the cavity of the polymer structure;
a semiconductor die within the cavity of the polymer structure and electrically coupled to the MEMS device;
a signal trace coupled to a signal output of the semiconductor die, the signal trace extending on the cavity bottom surface and extending on a first sidewall inner surface of the sidewall inner surfaces;
ground paths on sidewall external surfaces provided by the sidewalls of the polymer structure, wherein each sidewall external surface is separated from a respective sidewall inner surface by a thickness of a respective sidewall of the polymer structure and each of the ground paths is laterally bounded by polymer portions of the sidewall external surfaces; and
a substrate coupled to the polymer structure, wherein the substrate comprises a ground shield layer coupled to the ground paths, and wherein the substrate encloses the MEMS device and the semiconductor die within the cavity.
12. The semiconductor device of claim 11 , comprising a conductive land on a surface of the substrate opposite to the cavity.
13. The semiconductor device of claim 11 , wherein the signal trace extends to a top surface of the polymer structure.
14. The semiconductor device of claim 13 , wherein the signal trace is coupled to a conductive pattern on the top surface of the polymer structure.
15. The semiconductor device of claim 11 , further comprising a ground path on a second sidewall inner surface of the inner sidewall surfaces.
16. The semiconductor device of claim 11 , further comprising:
a first wire bond that electrically couples the semiconductor die to the signal trace; and
a second wire bond that electrically couples the MEMS device to the semiconductor die.
17. The semiconductor device of claim 11 , wherein:
the MEMS devices is mounted to the cavity bottom surface; and
the polymer structure comprises an orifice through the cavity bottom surface, the orifice positioned under the MEMS device.
18. The semiconductor device of claim 11 , wherein:
a portion of the signal trace lies on a top surface of the polymer structure; and
the substrate comprises:
a conductive pattern on an inner surface of the substrate, the conductive pattern coupled to the portion of the signal trace on the top surface of the polymer structure;
a conductive land on an outer surface of the substrate; and
a conductive via through the substrate that couples the conductive land to the conductive pattern.
19. The semiconductor device of claim 11 , wherein the polymer structure further comprises a ground shield layer that traverses the cavity bottom surface and that is coupled to the ground shield layer of the substrate via the ground paths of the polymer structure.
20. A method of fabricating a semiconductor device, the method comprising:
coupling a micro-electro mechanical systems (MEMS) device to a cavity bottom surface of a cavity in a polymer structure, the cavity defined by the cavity bottom surface and sidewall inner surfaces provided by sidewalls of the polymer structure, and the polymer structure comprising a signal trace extending on the cavity bottom surface and extending on a first sidewall inner surface of the sidewall inner surfaces;
coupling a semiconductor die to the cavity bottom surface such that a signal output of the semiconductor die is coupled to the signal trace; and
coupling a substrate to the polymer structure such that the substrate encloses the MEMs device and the semiconductor die within the cavity and electrically couples a ground shield layer of the substrate to ground paths on sidewall external surfaces of the polymer structure, wherein each sidewall external surface is separated from a respective sidewall inner surface by a thickness of a respective sidewall of the polymer structure.