IP Library › Assignment 048219/0582
Patent Assignment
Reel/Frame 048219/0582

Assignment of Assignor's Interest

Recorded: 2019-02-01 Pages: 2
Assignors
LIU, HAOCHUN
Executed: 2019-01-03
HSIAO, CHING-WEN
Executed: 2019-01-03
HSU, KUO-CHING
Executed: 2019-01-03
LII, MIRNG-JI
Executed: 2019-01-04
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property (1)
Bonding Structures in Semiconductor Packaged Device and Method of Forming Same
Application: 16/265,136 →
Publication: US 2020/0105682
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Corrective Assignment to Correct the First Inventor Name Previously Recorded at Reel: 048219 Frame: 0582. Assignor(S) Hereby Confirms the Assignment . Apr 13, 2022
From: LIU, HAO CHUN; HSIAO, CHING-WEN; HSU, KUO-CHING; LII, MIRNG-JI
To: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
Reel/Frame 059694/0849 →